DATE | HS_CODE | Product Description | Trademark | Country | Net Weight | Statistical Cost | Place | Shipper Name | Consignee Name |
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2017-09-05 | 3824999609 | IMPREGNATION "SILCADUR-HTI" for additional processing of insulation panels "SILCA" Before applying plaster, used to strengthen the surface of the plate and dust binding. IMPREGNATION "SILCADUR-HTI" in the canister 5 liters IMPREGNANT "SILCADUR-HTI" in the box OBE | *** | GERMANY | 70.6 | 160,4 | *** | ***** | ***** |
2017-09-26 | 3824999609 | EMULSION PREPARATION AND FLUSHING AND Offset printing plates are designed to remove surface oxidation from unused PRINTED ZON consists of silicon dioxide (9-20%, CAS 14808-60-7), PHOSPHORIC ACID (20-30%, CAS 7664-38 -2) 231-633-2, 2.4-4 | *** | FRANCE | 6530.05 | 16650,61 | *** | ***** | ***** |
2017-11-01 | 3816000000 | Mortars PN-AKM-S9 (0.25 VT) REPRESENTS Refractory SOLUTION CONTAINING AL2O3-85.25%, P2O5-1.64%, SIO2-7.51%. DESIGNED TO FILL GAPS and gluing the contact surface, ladle the glass and Gate PLATE, PLATE AND Gate | PRCO | CHINA | 250 | 552,84 | ST BOILER | ***** | ***** |
2017-11-04 | 3824999609 | EMULSION PREPARATION AND FLUSHING AND Offset printing plates are designed to remove surface oxidation from unused PRINTED ZON consists of silicon dioxide (9-20%, CAS 14808-60-7), PHOSPHORIC ACID (20-30%, CAS 7664-38 -2) | IMAF SPA | *** | 7163 | 18266,34 | MILAN | ***** | ***** |
2017-11-08 | 3824999609 | IMPREGNATION "SILCADUR-HTI" for additional processing of insulation panels "SILCA" Before applying plaster, used to strengthen the surface of the plate and dust binding. | SILCA | GERMANY | 72 | 163,6 | ST PETERSBURG | ***** | ***** |
2017-11-15 | 3818009000 | Monocrystalline wafers silicon carbide polished on both sides, vanadium-doped, semi-insulating, with the same conductivity over the entire surface of the plate to the ISP. As a basis for IZGOTOVLENIYAI heterostructures for microelectronics | SICC | CHINA | 2.36 | 38318,05 | JINAN | ***** | ***** |
2017-11-21 | 3824999609 | Colloidal solution used in the field of microelectronic industry, in particular for application to the surface of the sapphire PLATES BEFORE STARTING polishing process ((does not contain ethyl alcohol) | ABSENT | UNITED STATES | 11880 | 75542,17 | STAVROPOL | ***** | ***** |