DATE | HS_CODE | Product Description | Trademark | Country | Net Weight | Statistical Cost | Place | Shipper Name | Consignee Name |
---|
2017-10-03 | 7410210000 | CATALOG base laminate foil: STF 2-18-1,0 IKL "OS" 16kg; STF 2-35-1,5 IKL 156KG; STF 2-35-1,5 IKL "OS" 209KG; STF 2-35-0,25 IKL "OS" 147KG; SF-1H-0,5-35g IKL. "PZ" 1,6kg; SF-2-35G-1,5 IKL. 218KG; | PLANT Moldavizolit | *** | 1012.27 | 20721,3 | Tiraspol | ***** | ***** |
2017-10-04 | 7410210000 | The base material for printed circuit boards: copper foil into a dielectric substrate (epoxy resin and glass) | ISOLA | *** | 2010 | 60478,98 | RAUHA | ***** | ***** |
2017-10-06 | 7410210000 | CATALOG base laminate foil: STF 1-35-1,5 IKL 219KG; SSFV-1-35-1,0 1kl. (151KG) 20 sheets. | PLANT Moldavizolit | *** | 370 | 28515,08 | Tiraspol | ***** | ***** |
2017-10-11 | 7410210000 | The base material for printed circuit boards: copper foil into a dielectric substrate (epoxy resin and glass) | ISOLA | *** | 1850 | 46070,88 | RAUHA | ***** | ***** |
2017-10-12 | 7410210000 | CATALOG base laminate foil: SF-1-50G-1.5 IKL. 172KG; SF-1H-1,5-50G IKL. 100kg; SF-2-35G-0,8 IKL. 399KG; SF-2H-1,5-35g IKL. 1450KG; SF-2H-2,0-35g IKL. 501KG; MI 1222-2-18-2,0 IKL 197KG; | PLANT Moldavizolit | *** | 3536.02 | 69275,89 | Tiraspol | ***** | ***** |
2017-10-17 | 7410210000 | FR4 BASIC MATERIAL FOR PRINTED CIRCUIT BOARD: copper foil on an insulating base with drilled holes. | WITHOUT TZ | *** | 55.86 | 3943,49 | GARBSEN | ***** | ***** |
2017-10-17 | 7410210000 | CATALOG base laminate foil: SF-1-35G-1.5 IKL. 214KG; SF-1-50G-1,5 IKL. 103KG; SF-2-35G-1,5 IKL. 104kg; MI 1222-1-35-1,5 IKL 158KG. | PLANT Moldavizolit | *** | 582.39 | 6360,03 | Tiraspol | ***** | ***** |
2017-10-23 | 7410210000 | CATALOG base laminate foil: STF 1-18-0,13 IKL 84,5KG; STF 1-35-0,2 IKL 119,5KG; STF 1-35-0,2 IKL "PZ" 20,5KG; STF 1-35-3,0 IKL 106KG; STF 1-35-0,25 IKL 142,4KG; STF 1-35-0,25 IKL "OS" 5,5kg; STF 2-18-0,2 IKL 21kg; | PLANT Moldavizolit | *** | 9711.21 | 139388,96 | Tiraspol | ***** | ***** |
2017-10-24 | 7410210000 | FOIL from refined copper from the base thickness (excluding any backing) not exceeding 0.15 mm, copper foil is refined for manufacturing printed circuit boards for the electronics industry, mechanical engineering, ETC. | ITEQ | *** | 2262 | 17250,21 | TRENTO | ***** | ***** |
2017-10-25 | 7410210000 | The base material for printed circuit boards: copper foil into a dielectric substrate (epoxy resin and glass) | ISOLA | *** | 270 | 10424,11 | RAUHA | ***** | ***** |