| DATE | HS_CODE | Product Description | Trademark | Country | Net Weight | Statistical Cost | Place | Shipper Name | Consignee Name |
|---|
| 2017-09-01 | 3810100000 | PASTE for soldering on a batch production printed circuit boards, not of household chemical goods: Solder Paste (CNP OM5300 256 90-4-M17 JAR), as a ready to use of homogeneous composition consisting of metal powder and flux, COMPOSITION: F | *** | HUNGARY | 310 | 20338,88 | *** | ***** | ***** |
| 2017-09-05 | 3814009000 | THINNER (CLEANER) complex organic READY COMPOSITION FOR REMOVAL varnishes and paints, intended for use in manufacturing printed circuit boards, NOT CONTAIN ethyl alcohol, mineral oil and OZONE VESCHESTV.NE anticorrosive NOT BESTSV | *** | GERMANY | 100 | 1418,13 | *** | ***** | ***** |
| 2017-09-05 | 3824999609 | CHEMICAL PRODUCTS HIM.PRODUKT "SECURIGANTH 902 CLEANER (EU)" water-containing solution used as an additive in solution in TECHNOLOGICAL PROCESS metallization hole with chemical copper plating used in the manufacture of multilayer printed circuit boards. CHEM. Comp | *** | SLOVENIA | 125 | 594,7 | *** | ***** | ***** |
| 2017-09-06 | 3810100000 | Composition for etching copper surface BLANKS PRINTED CIRCUIT BOARD MECETCHBOND CZ-8100 R. process components MECETCHBOND - chemical cleaning copper surfaces of printed circuit boards BLANKS aqueous solution of inorganic compounds. CONTAINS: formic acid | *** | BELGIUM | 1333.2 | 4814,66 | *** | ***** | ***** |
| 2017-09-06 | 3810100000 | Lead-free solder paste LFM-48W TM-HP, Composition: 96.5% TIN, SILVER 3%, copper 0.5% Resin 12% by volume of paste, used in production of printed circuit boards for television, ART .: 0202-001830 - 440000 T; : HEESUNG MATERIAL LTD HEESUNG MATER | *** | KOREA REPUBLIC OF | 440 | 27551,67 | *** | ***** | ***** |
| 2017-09-13 | 3824995000 | Formulations for galvanizing ISP. BY AT microelectronic manufacturing printed circuit boards, GROSS WEIGHT from the pallet - 17423.000 KG 13058 DS-400 PREDIP, 25 L / 13058 DS-400, the pretreatment before the process of activation, in liquid form, to the | *** | SWEDEN | 16296.8 | 89736,68 | *** | ***** | ***** |
| 2017-09-13 | 3810909000 | PROTECTIVE COATING (FLUX-GEL) to cover printed circuit boards, plastic surfaces and the electrodes. ARE IN 10SM3 syringe. In Specialty Packaging, packaging is INSIDE the refrigerant to maintain the temperature during transport. :: HENKEL | *** | HUNGARY | 0.4 | 530,09 | *** | ***** | ***** |
| 2017-09-13 | 3810909000 | PROTECTIVE COATING (FLUX) to cover printed circuit boards, plastic surfaces and the electrodes. ::::: HENKEL LTD LOCTITE LOCTITE M310316 MFR301 16 HENKEL LTD LOCTITE LOCTITE M293100 NO 16 HENKEL LTD LOCTITE LOCTITE M290848 HYDRO X / 20 32 HENKEL LT | *** | HUNGARY | 460.8 | 2971,48 | *** | ***** | ***** |
| 2017-09-13 | 3810100000 | PASTA SOLDERING For soldering electronic components to a circuit board on automated assembly lines. PASTE COMPOSITION: METAL POWDER - TIN (SN) = 80-90%; SILVER (AG) = 0,5-1%; Copper (CU) = 0,5-1%; BI (BI); INDIUM (IN) and flux TYPE RO (ROSIN) | *** | UNITED KINGDOM | 28.5 | 2110,55 | *** | ***** | ***** |
| 2017-09-13 | 3810100000 | PASTE for soldering on a batch production printed circuit boards, not products, household chemical solder paste (CNP OM5300 256 90-4-M17 JAR), as a ready to use of homogeneous composition consisting of metal powder and flux, COMPOSITION: PL | *** | HUNGARY | 350 | 20103,61 | *** | ***** | ***** |