DATE | HS_CODE | Product Description | Trademark | Country | Net Weight | Statistical Cost | Place | Shipper Name | Consignee Name |
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2017-09-04 | 3907300000 | EPOXY RESIN The primary form, MARK HYSOL EE4215, BANK X 1 gallon (3.8 L) FOR REPAIR AND RESTORATION OF PRINTED CIRCUIT BOARD FOR ELECTRONIC OBORODUVANIYA civilian aircraft BOEING 737; MAPK .: 724-62092951: COMPOSITION EPOXY RESIN - 100%; DOES NOT CONTAIN E | *** | UNITED STATES | 30 | 1954,41 | *** | ***** | ***** |
2017-09-05 | 3907300000 | EPOXY RESIN conductive. Linings. Designed for gluing flat flexible conductors to the printed circuit board: VISHAY VISHAY 0 | *** | UNITED STATES | 1.63 | 3,3 | *** | ***** | ***** |
2017-09-05 | 3907300000 | EPOXY RESIN conductive. Linings. Designed for gluing flat flexible conductors to the printed circuit board: VISHAY VISHAY 0 | *** | UNITED STATES | 1.63 | 3,3 | *** | ***** | ***** |
2017-09-26 | 3907300000 | Polymer coatings based on epoxy resin, designed for filling holes circuit board that prevents solder on the component side at various stages during the soldering process, SOD.ETILOVOGO WITHOUT ALCOHOL: a protective liquid 2-component | *** | BELGIUM | 111 | 2502,38 | *** | ***** | ***** |
2017-09-26 | 3907300000 | Polymer coatings based on epoxy resin, designed for filling holes circuit board that prevents solder on the component side at various stages during the soldering process, SOD.ETILOVOGO WITHOUT ALCOHOL: a protective liquid 2-component | *** | BELGIUM | 111 | 2502,38 | *** | ***** | ***** |
2017-09-27 | 3907300000 | FOTOPROYAVLYAEMAYA LIQUID solder mask, Linings. Do not contain alcohol. MODEL RS2000. Only 330 sets. FOTOPROYAVLYAEMAYA LIQUID solder mask, Linings. SCOPE: printed circuit board with high density. WITHOUT ALCOHOL CONTENT. COMPOSITION: | *** | CHINA | 340 | 4899,14 | *** | ***** | ***** |
2017-09-27 | 3907300000 | FOTOPROYAVLYAEMAYA LIQUID solder mask, Linings. Do not contain alcohol. MODEL RS2000. Only 330 sets. FOTOPROYAVLYAEMAYA LIQUID solder mask, Linings. SCOPE: printed circuit board with high density. WITHOUT ALCOHOL CONTENT. COMPOSITION: | *** | CHINA | 340 | 4899,14 | *** | ***** | ***** |
2017-10-05 | 3907300000 | EPOXY RESIN The primary forms COMPLETE hardener MARK HYSOL 608 x 4 SET GR NOT CONTAIN ETHANOL, INTENDED FOR REPAIR AND RESTORATION OF PRINTED CIRCUIT BOARD FOR ELECTRONIC OBORODUVANIYA civilian aircraft BOEING 737.: MARK .: | *** | UNITED STATES | 0.7 | 204,75 | *** | ***** | ***** |
2017-10-11 | 3907300000 | EPOXY RESIN conductive. Linings. Designed for gluing flat flexible conductors to the printed circuit board: VISHAY VISHAY 0 | *** | UNITED STATES | 3.61 | 7,3 | *** | ***** | ***** |
2017-11-02 | 3907300000 | Polymer coatings based on epoxy resin, designed for filling holes circuit board that prevents solder on the component side at various stages during the soldering process, SOD.ETILOVOGO WITHOUT ALCOHOL, Cat. In 8KART.KOR. | PETERS | *** | 8 | 532,78 | MOSCOW | ***** | ***** |