DATE | HS_CODE | Product Description | Trademark | Country | Net Weight | Statistical Cost | Place | Shipper Name | Consignee Name |
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2017-10-04 | 7410210000 | The base material for printed circuit boards: copper foil into a dielectric substrate (epoxy resin and glass) | ISOLA | *** | 2010 | 60478,98 | RAUHA | ***** | ***** |
2017-10-11 | 7410210000 | The base material for printed circuit boards: copper foil into a dielectric substrate (epoxy resin and glass) | ISOLA | *** | 1850 | 46070,88 | RAUHA | ***** | ***** |
2017-10-24 | 7410210000 | FOIL from refined copper from the base thickness (excluding any backing) not exceeding 0.15 mm, copper foil is refined for manufacturing printed circuit boards for the electronics industry, mechanical engineering, ETC. | ITEQ | *** | 2262 | 17250,21 | TRENTO | ***** | ***** |
2017-10-25 | 7410210000 | The base material for printed circuit boards: copper foil into a dielectric substrate (epoxy resin and glass) | ISOLA | *** | 270 | 10424,11 | RAUHA | ***** | ***** |
2017-10-25 | 7410210000 | COPPER FOIL from refined (in leaves) no thicker than 0.15 mm, with a core of glass-cloth. It is used for manufacturing printed circuit boards for the electronics industry, mechanical engineering: | GEM | *** | 13995 | 74453,4 | SHANGHAI | ***** | ***** |
2017-11-09 | 7410210000 | The base material for printed circuit boards: copper foil into a dielectric substrate (epoxy resin and glass) | ISOLA | *** | 4810 | 100667,1 | RAUHA | ***** | ***** |
2017-11-09 | 7410210000 | The base material for printed circuit boards: copper foil into a dielectric substrate (epoxy resin and glass) | ISOLA | *** | 145 | 10331,01 | RAUHA | ***** | ***** |
2017-11-14 | 7410210000 | COPPER FOIL from refined (in leaves) no thicker than 0.15 mm, with a core of glass-cloth. It is used for manufacturing printed circuit boards for the electronics industry, mechanical engineering: | GEM | *** | 17205 | 103497,96 | SHANGHAI | ***** | ***** |
2017-11-14 | 7410210000 | Refined COPPER FOIL (in sheets) thickness not exceeding 0.15 mm, with the basics, are used for manufacturing printed circuit boards for the electronics industry, mechanical engineering: | ITEQ | *** | 3072 | 17534,96 | SHANGHAI | ***** | ***** |
2017-11-16 | 7410210000 | FR-4 glass fiber: glass fiber COPPER SINGLE foil reinforced with a dielectric on the basis of glass mesh, impregnated and polymerized epoxy resins, FOIL - COPPER; INTENDED FOR MANUFACTURING PRINTED CIRCUIT BOARDS DIFFERENT CTE | not designated | *** | 19080 | 113036 | ORIENTAL | ***** | ***** |