DATE | HS_CODE | Product Description | Trademark | Country | Net Weight | Statistical Cost | Place | Shipper Name | Consignee Name |
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2017-09-08 | 3910000008 | Silicone paste for computers, has high thermal conductivity and is used to remove heat from the chip to a radiator COOLING SYSTEM, DOES NOT CONTAIN ETHANOL, thermopaste 480354-001 HP HEWLETT-PACKARD CO. HP HP 480354-001 480354-001 1 | *** | CHINA | 0.04 | 75,02 | *** | ***** | ***** |
2017-09-08 | 3910000008 | Silicone paste for computers, has high thermal conductivity and is used to remove heat from the chip to a radiator COOLING SYSTEM, DOES NOT CONTAIN ETHANOL, thermopaste 480354-001 HP HEWLETT-PACKARD CO. HP HP 480354-001 480354-001 1 | *** | CHINA | 0.04 | 75,02 | *** | ***** | ***** |
2017-09-21 | 3910000008 | SILICONE BASED thermopaste NOTEBOOK (no ethanol), used to improve the thermal conductivity between the fuel elements of electronic circuits thermopaste 855712-001 HP HEWLETT-PACKARD CO. HP 855712-001 855712-001 1 | *** | CHINA | 0.04 | 62,52 | *** | ***** | ***** |
2017-09-21 | 3910000008 | SILICONE BASED thermopaste NOTEBOOK (no ethanol), used to improve the thermal conductivity between the fuel elements of electronic circuits thermopaste 855712-001 HP HEWLETT-PACKARD CO. HP 855712-001 855712-001 1 | *** | CHINA | 0.04 | 62,52 | *** | ***** | ***** |
2017-09-28 | 3910000008 | SILICONE BASED thermopaste NOTEBOOK (no ethanol), used to improve the thermal conductivity between the fuel elements of electronic circuits thermopaste HP 855712-001 HEWLETT-PACKARD CO. HP 855712-001 855712-001 1 | *** | CHINA | 0.04 | 63,01 | *** | ***** | ***** |
2017-09-28 | 3910000008 | SILICONE BASED thermopaste NOTEBOOK (no ethanol), used to improve the thermal conductivity between the fuel elements of electronic circuits thermopaste HP 855712-001 HEWLETT-PACKARD CO. HP 855712-001 855712-001 1 | *** | CHINA | 0.04 | 63,01 | *** | ***** | ***** |
2017-10-10 | 3910000008 | SILICONE BASED thermopaste NOTEBOOK (no ethanol), used to improve the thermal conductivity between the fuel elements of electronic circuits thermopaste 855712-001 HP HEWLETT-PACKARD CO. HP 855712-001 855712-001 1 | *** | CHINA | 0.04 | 62,6 | *** | ***** | ***** |
2017-10-31 | 3910000008 | SILICONE BASED thermopaste NOTEBOOK (no ethanol), used to improve the thermal conductivity between the fuel elements of electronic circuits thermopaste HP 480354-001 HEWLETT-PACKARD CO. HP 480354-001 480354-001 1 | *** | CHINA | 0.29 | 75 | *** | ***** | ***** |