DATE | HS_CODE | Product Description | Trademark | Country | Net Weight | Statistical Cost | Place | Shipper Name | Consignee Name |
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2017-09-01 | 3810100000 | PASTE for soldering on a batch production printed circuit boards, not of household chemical goods: Solder Paste (CNP OM5300 256 90-4-M17 JAR), as a ready to use of homogeneous composition consisting of metal powder and flux, COMPOSITION: F | *** | HUNGARY | 310 | 20338,88 | *** | ***** | ***** |
2017-09-06 | 3810100000 | Lead-free solder paste LFM-48W TM-HP, Composition: 96.5% TIN, SILVER 3%, copper 0.5% Resin 12% by volume of paste, used in production of printed circuit boards for television, ART .: 0202-001830 - 440000 T; : HEESUNG MATERIAL LTD HEESUNG MATER | *** | KOREA REPUBLIC OF | 440 | 27551,67 | *** | ***** | ***** |
2017-09-13 | 3810100000 | PASTE for soldering on a batch production printed circuit boards, not products, household chemical solder paste (CNP OM5300 256 90-4-M17 JAR), as a ready to use of homogeneous composition consisting of metal powder and flux, COMPOSITION: PL | *** | HUNGARY | 350 | 20103,61 | *** | ***** | ***** |
2017-09-14 | 3810100000 | PASTE for soldering on a batch production printed circuit boards, not products, household chemical solder paste (CNP OM5300 256 90-4-M17 JAR), as a ready to use of homogeneous composition consisting of metal powder and flux, COMPOSITION: PL | *** | *** | 350 | 19963,36 | *** | ***** | ***** |
2017-09-19 | 3810100000 | PASTE for soldering on a batch production printed circuit boards, not of household chemical goods: Solder Paste (CNP OL107F (A) 246 89-4-M20 JAR), IS READY TO USE homogeneous composition consisting of metal powder and flux: | *** | HUNGARY | 165 | 8962,56 | *** | ***** | ***** |
2017-09-20 | 3810100000 | Lead-free solder paste LFM-48W TM-HP, Composition: 96.5% TIN, SILVER 3%, copper 0.5% Resin 12% by volume of paste, used in production of printed circuit boards for television, ART .: 0202-001830 - 360000 T; : HEESUNG MATERIAL LTD HEESUNG MATER | *** | KOREA REPUBLIC OF | 360 | 22485,23 | *** | ***** | ***** |
2017-09-26 | 3810100000 | PASTE for soldering on a batch production printed circuit boards, not products, household chemical solder paste (CNP OM345 771 88.5-3-M19 JAR), AS is ready to use GOMOGENNOG COMPOSITION metal powder and flux COMPOSITION: FLUX 10 wt% | *** | UNITED STATES | 462 | 23533,41 | *** | ***** | ***** |
2017-09-27 | 3810100000 | PASTE for soldering on a batch production printed circuit boards, not products, household chemical solder paste (CNP OM345 771 88.5-3-M19 JAR), AS is ready to use GOMOGENNOG COMPOSITION metal powder and flux COMPOSITION: FLUX 10 wt% | *** | HUNGARY | 462 | 23552,8 | *** | ***** | ***** |
2017-09-29 | 3810100000 | Lead-free solder paste LFM-48W TM-HP, Composition: 96.5% TIN, SILVER 3%, copper 0.5% Resin 12% by volume of paste, used in production of printed circuit boards for television, ART .: 0202-001830 - 500000 T; : HEESUNG MATERIAL LTD HEESUNG MATER | *** | KOREA REPUBLIC OF | 500 | 31001,64 | *** | ***** | ***** |
2017-11-08 | 3810100000 | Lead-free solder paste LFM-48W TM-HP, Composition: 96.5% TIN, SILVER 3%, copper 0.5% Resin 12% by volume of paste, used in production of printed circuit boards for television, ART .: 0202-001830 - 300000 T; | HEESUNG MATERIAL | KOREA REPUBLIC OF | 300 | 18042 | Incheon | ***** | ***** |