DATE | HS_CODE | Product Description | Trademark | Country | Net Weight | Statistical Cost | Place | Shipper Name | Consignee Name |
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2017-09-04 | 8486209009 | The DTX - INSTALLATION scribing and separation into chips - 1 PCS. HOW IT WORKS: using a diamond cutter to move along the surface of semiconductor wafers up to 200 mm along the line of scribing, separated by a single crystal at the surface: semiconductors | *** | UNITED STATES | 650 | 454845,99 | *** | ***** | ***** |
2017-09-05 | 8486209003 | To remove the photoresist AND TREATMENT OF SEMICONDUCTOR PLATES: INSTALLATION plasma clearance ATTO, at a specified EQUIPMENT is designed for plasma-chemical processing of semiconductor wafers and substrates up to 200 mm in diameter for issl | *** | GERMANY | 58 | 10124,18 | *** | ***** | ***** |
2017-09-07 | 8467298509 | ELECTRIC vacuum pickup ART.AV-5000-MW8-220 - 6 pcs. POWER SUPPLY: 220 V AC (50-60 Hz). APPLY FOR RETENTION AND HANDLING thin semiconductor wafers to 8 inches, prevent them from touching any electric or | *** | UNITED STATES | 9 | 3190,31 | *** | ***** | ***** |
2017-09-07 | 8467298509 | ELECTRIC vacuum pickup ART. WV-900-MW4-220 - 1 PCS. POWER SUPPLY: 220 V AC (50-60 Hz). APPLY FOR RETENTION AND HANDLING thin semiconductor wafers to 8 inches, prevent them from touching any electric or | *** | UNITED STATES | 1.7 | 349,92 | *** | ***** | ***** |
2017-09-07 | 8467990009 | Part of the tool. USED ​​TOGETHER WITH ELECTRIC The vacuum pickup WV-9000-MW4-220, AV-5000-MW8-220 and AV-6000-FS-220. SCOPE: the manufacture of semiconductor wafers and laser modules CHIPS FOR TRAVEL TIPS TO ELECT | *** | UNITED STATES | 1.2 | 3671,6 | *** | ***** | ***** |
2017-09-07 | 8486209009 | MACHINERY, EQUIPMENT FOR OL-VA semiconductor devices, electronic. INTEGRATED CIRCUITS 7000 0004 CLEANING SYSTEM OKO2000MP / 7000 0004 CLEANING SYSTEM OKO2000MP with microprocessor control is intended for aqueous cleaning semiconductor wafers, hard | *** | UNITED KINGDOM | 154 | 10781,15 | *** | ***** | ***** |
2017-09-20 | 8486209009 | INSTALLATION plasma etching inductively coupled plasma ART: CORIAL 210IL INTENDED: for etching different layers on semiconductor wafers. Plasma etching - a technology and dry etching is used to remove a portion of F | *** | FRANCE | 940 | 450783,52 | *** | ***** | ***** |
2017-09-20 | 8481805990 | Fixture: REGULATORY EQUIPMENT - distributing equipment wall mounted FOR SAFE DELIVERY NON-HAZARDOUS GASES used in the manufacture of semiconductor wafers, NOT MILITARY IS NOT THE INSTRUMENT OF FIRE | *** | UNITED KINGDOM | 28 | 4102,87 | *** | ***** | ***** |
2017-09-21 | 8486209009 | INSTALLATION plasma treatment of surfaces of semiconductor wafers are used in the semiconductor industry Manufacturing Cycle microelectronic components, not for military purposes, NOT FOR MEDICINE, AND DOES NOT CONSTITUTE RES VCHU.POSTAVLYAETSYA PER HOUR: | *** | GERMANY | 106 | 30150,49 | *** | ***** | ***** |
2017-10-04 | 8486909008 | PARTS EXCLUSIVELY intended for installation JUSUNG GENAON PLUS ETCHING hard mask and the magnetic layers with plasma silicon wafers IN SEMICONDUCTOR MANUFACTURING: | JUSUNG | *** | 150 | 50319,93 | Gyeonggi | ***** | ***** |