DATE | HS_CODE | Product Description | Trademark | Country | Net Weight | Statistical Cost | Place | Shipper Name | Consignee Name |
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2017-09-12 | 8534001100 | With the multilayer printed circuit wiring and the contact pads, without establishing ELEMENTS INTENDED FOR USE IN TELECOMMUNICATIONS EQUIPMENT multilayer printed circuit boards with conductive paths, without the establishment of EL | *** | MALAYSIA | 1.15 | 191,73 | *** | ***** | ***** |
2017-09-12 | 8534001100 | With the multilayer printed circuit wiring and the contact pads, without establishing ELEMENTS INTENDED FOR USE IN TELECOMMUNICATIONS EQUIPMENT multilayer printed circuit boards with conductive paths, without the establishment of EL | *** | MALAYSIA | 2.04 | 449,19 | *** | ***** | ***** |
2017-09-12 | 8534001100 | With the multilayer printed circuit wiring and the contact pads, without establishing ELEMENTS INTENDED FOR USE IN TELECOMMUNICATIONS EQUIPMENT multilayer printed circuit boards with conductive paths, without the establishment of EL | *** | MALAYSIA | 1.45 | 327,87 | *** | ***** | ***** |
2017-09-12 | 8534001100 | With the multilayer printed circuit wiring and the contact pads, without establishing ELEMENTS INTENDED FOR USE IN TELECOMMUNICATIONS EQUIPMENT multilayer printed circuit boards with conductive paths, without the establishment of EL | *** | MALAYSIA | 1.09 | 276,4 | *** | ***** | ***** |
2017-09-12 | 8534001100 | With the multilayer printed circuit wiring and the contact pads, without establishing ELEMENTS INTENDED FOR USE IN TELECOMMUNICATIONS EQUIPMENT multilayer printed circuit boards with conductive paths, without the establishment of EL | *** | MALAYSIA | 1.37 | 261,44 | *** | ***** | ***** |
2017-09-12 | 8534001100 | With the multilayer printed circuit wiring and the contact pads, without establishing ELEMENTS INTENDED FOR USE IN TELECOMMUNICATIONS EQUIPMENT multilayer printed circuit boards with conductive paths, without the establishment of EL | *** | MALAYSIA | 1.35 | 243,11 | *** | ***** | ***** |
2017-09-12 | 8534001100 | With the multilayer printed circuit wiring and the contact pads, without establishing ELEMENTS INTENDED FOR USE IN TELECOMMUNICATIONS EQUIPMENT multilayer printed circuit boards with conductive paths, without the establishment of EL | *** | MALAYSIA | 2.02 | 291,68 | *** | ***** | ***** |
2017-09-28 | 8534001100 | MULTILAYER CIRCUIT BOARD WITH wirings, contact pads ELEMENT WITHOUT INSTALLED (PLATE KE.15.46.01-02 + KE.15.46.02-02) intended for use in telecommunication equipment ORDERING multilayer circuit board | *** | CHINA | 844.8 | 18252 | *** | ***** | ***** |
2017-11-02 | 8534001100 | With the multilayer printed circuit wiring and the contact pads, without establishing ELEMENTS INTENDED FOR USE IN TELECOMMUNICATIONS EQUIPMENT | BENETEK HK | *** | 0.39 | 187,02 | HONG KONG | ***** | ***** |
2017-11-17 | 8534001100 | With the multilayer printed circuit wiring and the contact pads, without establishing ELEMENTS INTENDED FOR USE IN TELECOMMUNICATIONS EQUIPMENT | APCB | *** | 11.05 | 238,37 | HONG KONG | ***** | ***** |