DATE | HS_CODE | Product Description | Trademark | Country | Net Weight | Statistical Cost | Place | Shipper Name | Consignee Name |
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2017-09-05 | 8486209003 | To remove the photoresist AND TREATMENT OF SEMICONDUCTOR PLATES: INSTALLATION plasma clearance ATTO, at a specified EQUIPMENT is designed for plasma-chemical processing of semiconductor wafers and substrates up to 200 mm in diameter for issl | *** | GERMANY | 58 | 10124,18 | *** | ***** | ***** |
2017-09-21 | 8486209009 | INSTALLATION plasma treatment of surfaces of semiconductor wafers are used in the semiconductor industry Manufacturing Cycle microelectronic components, not for military purposes, NOT FOR MEDICINE, AND DOES NOT CONSTITUTE RES VCHU.POSTAVLYAETSYA PER HOUR: | *** | GERMANY | 106 | 30150,49 | *** | ***** | ***** |
2017-10-04 | 8486209003 | SYSTEM wet chemistry ULTRA-CLEAN wafer. Used in the manufacture of semiconductor devices and integrated circuits in the technological process of clearing of semiconductor wafers. DOES NOT CONTAIN SOURCES IONIZIRUYUSCHEG | ATP | GERMANY | 120 | 127732,92 | PUTTEN | ***** | ***** |
2017-10-04 | 8486209003 | SYSTEM wet chemistry ULTRA-CLEAN wafer. Used in the manufacture of semiconductor devices and integrated circuits in the technological process of clearing of semiconductor wafers. DOES NOT CONTAIN SOURCES IONIZIRUYUSCHEG | ATP | GERMANY | 120 | 127732,92 | PUTTEN | ***** | ***** |
2017-10-06 | 8486909008 | PART FOR INDUSTRIAL PLANTS BY APPLICATION OF THIN-FILM COATINGS physical sputtering from the gas phase on a semiconductor wafer SINGULUS TIMARIS - RING SET SCREW STAINLESS STEEL ART.100169070-000. Designed to fix | ABSENT | GERMANY | 4.46 | 3605,46 | MOSCOW | ***** | ***** |
2017-10-06 | 8486909008 | PART FOR INDUSTRIAL PLANTS BY APPLICATION OF THIN-FILM COATINGS physical sputtering from the gas phase on a semiconductor wafer SINGULUS TIMARIS - RING SET SCREW STAINLESS STEEL ART.100169070-000. Designed to fix | ABSENT | GERMANY | 4.46 | 3605,46 | MOSCOW | ***** | ***** |
2017-10-23 | 8486209003 | To remove the photoresist or cleaning semiconductor wafers: for rinsing and drying a semiconductor wafer. NO MILITARY, NOT DOMESTIC USE, DO NOT SCRAP EL.OBORUDOVANIYA | RAMGRABER GMBH | GERMANY | 110 | 29006,19 | Brunnthal HOFOLDING GERMANY | ***** | ***** |
2017-10-23 | 8486209003 | To remove the photoresist or cleaning semiconductor wafers: for rinsing and drying a semiconductor wafer. NO MILITARY, NOT DOMESTIC USE, DO NOT SCRAP EL.OBORUDOVANIYA | RAMGRABER GMBH | GERMANY | 110 | 29006,19 | Brunnthal HOFOLDING GERMANY | ***** | ***** |
2017-10-24 | 8486909008 | SECTION LINE APPLICATION on a silicon wafer LAYERS transparent conductive oxide and a metal magnetron sputter HELIA PVD, AVAILABLE FOR FREE on their own production companies, recipients designed specifically | MEYER BURGER | GERMANY | 805 | 35265,01 | Novocheboksarsk | ***** | ***** |
2017-10-24 | 8486909008 | SECTION LINE APPLICATION on a silicon wafer LAYERS transparent conductive oxide and a metal magnetron sputter HELIA PVD, AVAILABLE FOR FREE on their own production companies, recipients designed specifically | MEYER BURGER | GERMANY | 805 | 35265,01 | Novocheboksarsk | ***** | ***** |