DATE | HS_CODE | Product Description | Trademark | Country | Net Weight | Statistical Cost | Place | Shipper Name | Consignee Name |
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2017-09-01 | 8536901000 | Contact elements for wires and cables PROBE-metallic contact in the form of pins, is used to test semiconductor wafers and devices for voltage 5V NIZKOVOLTNYE.NE is a means of fire automatics. : F89917K250U350S1, CONTACT dammed | *** | UNITED STATES | 0.4 | 695,66 | *** | ***** | ***** |
2017-09-13 | 8541100009 | DIODES - the semiconductor wafer is cut into the crystal (located in the same building), for devices of industrial electronics, ARE NOT diode grounders DEVICES catenary CLASSIFICATION CODE 6340112: DIODE VOLTAGE SUPPRESSION Transient | *** | UNITED STATES | 0 | 3,01 | *** | ***** | ***** |
2017-09-13 | 8541100009 | DIODES - the semiconductor wafer is cut into the crystal (located in the same building), for devices of industrial electronics, ARE NOT diode grounders DEVICES catenary CLASSIFICATION CODE 6340112: Schottky diodes, reverse voltage of 60 V, DIRECT | *** | UNITED STATES | 0.01 | 56,33 | *** | ***** | ***** |
2017-09-13 | 8541100009 | DIODES - the semiconductor wafer is cut into the crystal (located in the same building), for devices of industrial electronics, ARE NOT diode grounders DEVICES catenary CLASSIFICATION CODE 6340112: rectifier diodes, maximum reverse | *** | UNITED STATES | 0.19 | 75,03 | *** | ***** | ***** |
2017-09-18 | 8541100009 | DIODES, EXCEPT photodiodes and light-emitting diodes: diodes - a semiconductor wafer is cut into the crystal (located in the same building) for devices of industrial electronics DIODES - the semiconductor wafer is cut into the crystal (Location | *** | UNITED STATES | 0.02 | 2,93 | *** | ***** | ***** |
2017-09-18 | 8541100009 | DIODES, EXCEPT photodiodes and light-emitting diodes: diodes - a semiconductor wafer is cut into the crystal (located in the same building) for devices of industrial electronics DIODES - the semiconductor wafer is cut into the crystal (Location | *** | UNITED STATES | 1.02 | 2363,85 | *** | ***** | ***** |
2017-09-18 | 8541100009 | DIODES, EXCEPT photodiodes and light-emitting diodes: diodes - a semiconductor wafer is cut into the crystal (located in the same building) for devices of industrial electronics DIODES - the semiconductor wafer is cut into the crystal (Location | *** | UNITED STATES | 0.04 | 5,9 | *** | ***** | ***** |
2017-09-18 | 8541100009 | DIODES, EXCEPT photodiodes and light-emitting diodes: diodes - a semiconductor wafer is cut into the crystal (located in the same building) for devices of industrial electronics DIODES - the semiconductor wafer is cut into the crystal (Location | *** | UNITED STATES | 0.04 | 3,75 | *** | ***** | ***** |
2017-09-21 | 8536902000 | PROBES FOR VERIFICATION wafer for voltage up to 1000 V: part of the probe station. They are an integral part and not intended for independent use. HAS RADIOELKTR.I VYSOKOCHAST.SRE-B. PROBE, 50 GHz, CONFIGURATION G | *** | UNITED STATES | 4.4 | 34719,54 | *** | ***** | ***** |
2017-09-22 | 8537109900 | PANEL, PART.â„– G7402-05, State: After restoration, for predictive maintenance and repair of civil passenger aircraft Boeing-737, MARKING: 020-6814 4963 CONTROL PANEL. DESCRIPTION: PANEL wafer switches. PLACE SETTING | *** | UNITED STATES | 1 | 7371,83 | *** | ***** | ***** |